Global Wafer Capacity

The Global Wafer Capacity 2014 report offers a detailed breakdown of the IC industry's wafer fab capacity as it stood at the end of 2013 and then forecasts capacity for each year through 2018. The data were compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies. Surveys of hundreds of fabs from around the world formed the basis for analyzing the IC industry's current capacity status. Future projections were based on both survey results and IC Insights' overall economic forecast for the IC industry.

The capacity analysis and forecast is presented in more than 60 charts and tables. In addition, there are two addendums to the report: a 46-page collection of profiles for the world's IC manufacturers that are leading the industry in 300mm production and have the most potential to use next-generation 450mm wafers; and a 24-page listing showing detailed specifications, such as wafer size, capacity, and minimum process geometry, for all the fabs considered for the study.

Addendum I: Profiles of Potential 450mm Wafer Manufacturers

Profiles of the world's leading IC manufacturers, with extra emphasis placed on each company's strategy with regard to existing 300mm fabs and the potential for participating in 450mm fabrication in the future.

Addendum II: Detailed Fab Specifications Provided

For each of the 375 or so fab facilities surveyed for this study, detailed specifications are provided in this addendum. The specifications include:

• Company Name Fab Name
• Fab Location (city, state, province, prefecture, county, etc).
• Date Opened
• Wafer Size (mm)
• Wafer Capacity (wafers/month) as of Dec-2013 and Planned Maximum Capacity
• Process(es) Ran
• Minimum Geometry of Processes
• Product(s) Fabricated